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Phenyl silicone resin is a three-dimensional crosslinked organosilicon polymer with Si-O-Si backbone and phenyl groups bonded to silicon atoms. Compared with methyl silicone resin, it features superior heat resistance, radiation resistance, high refractive index and better compatibility with most organic resins. It is widely applied in high-temperature coatings, class H insulating varnishes, LED optical encapsulants and weather-resistant protective films.
Chemical name: Siloxanes and silicones, di-Me, methoxy Ph, polymers with phenyl silsesquioxanes, methoxy-terminated
Appearance: Transparent pale yellow liquid, methylphenyl silicone resin with reactive methoxy end groups.
Features: Ready-to-use at ambient temperature, good fluidity for formulation; crosslinkable via methoxy groups under heat or ambient condition; good thermal & radiation resistance and excellent compatibility with organic resins.
Applications: Class H insulating varnish, high-temperature liquid coatings, LED encapsulation, substrate impregnation for spray, dip and brush coating.
Chemical name: Methylphenyl silicone resin (solid flake, silanol functional)
Appearance: Colorless to light amber brittle solid flakes, 100% solids, solvent-free, meltable upon heating and soluble in aromatic solvents like xylene.
Features: Low VOC; crosslink via silanol groups during thermal curing; higher molecular weight, harder cured film and superior thermal aging resistance; stable storage and transportation.
Applications: High-temperature powder coatings, organic resin modifier, high-temperature composites, mica board impregnation, ideal for high-solid or solvent-free formulations.
Functional groups: CAS 68957-04-0 liquid resin with methoxy termination; CAS 68037-81-0 flake resin with silanol groups.
Processing: Liquid resin can be directly formulated for spraying/dipping; flake resin needs melting or dissolution in solvent before use.
Formulation strengths: Liquid grade for conventional solvent-borne coatings and impregnation; flake grade for low-VOC and powder coatings, delivering harder cured films.
Related intermediates: SF-S103 Phenyltrimethoxysilane, SF-S203 Diphenyldimethoxysilane and SF-SO84 Octaphenylcyclotetrasiloxane. For a COA, an SDS or a quotation, contact our sales team.
